The silicon — who makes what, and what it actually does.
There are fewer players than the marketing suggests, and the field consolidated sharply when Qualcomm closed its acquisition of Autotalks in 2025, removing the only significant independent V2X-dedicated fabless chipmaker. What follows is what each vendor actually publishes, with the security capability called out separately, because that is where the differences that matter live.
RoadLINK, the S32 platform, and the OrangeBox reference design.
- SAF5400 — single-chip 802.11p / DSRC / ITS-G5 V2X modem. Compliant with IEEE 802.11p, IEEE 1609.4, ETSI EN 302 663 and EN 302 571. ECDSA verification of up to 2,000 messages per second on-chip — which is the number to hold on to, because verification throughput is the binding constraint in dense traffic. Host interfaces SDIO and SPI. AEC-Q100 Grade 2. Still an active part; the datasheet block diagram was last updated December 2025.
- SAF5100 — V2X baseband processor, the companion architecture.
- SXF1800 — RoadLINK secure element for V2X. The first standalone V2X secure element to obtain Common Criteria certification, at EAL4+, certified 6 January 2020, third-party tested by Riscure to the highest attack potential AVA_VAN.5, compliant with the CAR 2 CAR Communication Consortium V2X HSM Protection Profile. ECC in short Weierstrass form covering NIST and Brainpool curves, secure field firmware update, high-speed SPI, −40 °C to +105 °C, AEC-Q100. That certification is NXP's own published claim, for NXP's silicon.
- NCJ38A — external automotive secure element used in OrangeBox 2.0.
- OrangeBox 2.0 — announced at Computex, May 2025, shipping H2 2025. An automotive connectivity domain controller reference platform built on the i.MX 94 applications processor: four Arm Cortex-A55, two Cortex-M7, two Cortex-M33, an eIQ Neutron NPU at 0.5 TOPS, and an EdgeLock Secure Enclave with post-quantum-cryptography readiness and an ISO 26262 ASIL-B safety island. Connectivity: DSRC V2X via SAF5400 plus SXF1800, Wi-Fi 6E, Bluetooth LE 6.0 with channel sounding, 5G, two 2.5 Gbit/s plus three 1 Gbit/s Ethernet ports, two CAN-FD, high-precision GNSS. NXP claims four times the performance of the previous i.MX 8XLite-based OrangeBox.
NXP's publicly documented V2X modems are 802.11p / DSRC parts. No confirmed NXP LTE-V2X or NR-V2X PC5 modem part number was found, and none is claimed here.
Now structurally dominant, after the Autotalks acquisition closed.
- 9150 C-V2X — 3GPP Release 14 LTE-V2X PC5 direct. 20 MHz channel bandwidth, 23 dBm, LTE TDD Band 47 and Band 46D, USIM-less operation, integrated 10 Hz GNSS covering GPS, GLONASS, Galileo, BeiDou, QZSS and SBAS with absolute GPS time and time uncertainty, plus Qualcomm Dead Reckoning. Now marked “Not for new design.”
- SA515M — Snapdragon Automotive 5G platform with integrated C-V2X; the basis of the Connected Car Application Reference Design, and the C-V2X radio in the Cohda MK6 RSU.
- Snapdragon Auto 5G Modem-RF and Modem-RF Gen 2 — the current commercial path for Release-16-class automotive connectivity, and the platform Commsignia's stack ships on.
- Autotalks acquisition completed 5 June 2025, roughly two years after the original May 2023 agreement, following regulatory review. GM, Renault, VW Cariad, Continental and Harman all publicly welcomed the deal — a useful list of who is still investing in V2X.
CRATON2, SECTON and TEKTON3.
- CRATON2 — second-generation SoC. Dual-channel and diversity operation of IEEE 802.11p and C-V2X PC5 Release 14/15 concurrently, or single channel with transmit/receive diversity. Integrated dual-core Arm Cortex-A7 application processor. Embedded eHSM with line-rate ECDSA hardware verification. Optional secure CAN MCU with CAN-FD and FlexRay. Gigabit Ethernet with AVB, USB 2.0, dual CAN, GNSS. AEC-Q100 Grade 2, −40 °C to +105 °C ambient.
- SECTON and SECTON3 — V2X hardware security add-on and modem companion products.
- TEKTON3 — third generation. Supports all V2X radio technologies: DSRC/802.11p, LTE-V2X Release 14/15 and 5G NR-V2X Release 16/17/18, with dual radios simultaneously and full transmit/receive diversity across dual antennas. Ultra-low-latency eHSM with hardware verification. ISO 26262 ASIL-B capable — Autotalks positioned it as the first V2X part able to support automatic braking rather than warning only. 105 °C ambient qualification, integrated V2X software stack.
Relevant at the security and in-vehicle-network layer rather than the radio.
- ATECC608A / 608B / 608C and ATECC608x-TFLXTLS — CryptoAuthentication secure elements with hardware ECC P-256 key generation and storage, ECDSA sign and verify, ECDH, AES-128, SHA-256, monotonic counters and a tamper-resistant key store. Delivered through the Trust Platform provisioning models: TrustFLEX (pre-configured with customer-defined certificates and keys), TrustCUSTOM (fully custom) and TrustAndGO.
- CryptoAutomotive security ICs — automotive Trust Anchor devices for retrofitting secure boot, message authentication and key storage into existing in-vehicle networks with minimal design impact.
- Automotive Ethernet and TSN — LAN9662 / LAN966x and VSC-series switches and PHYs supporting IEEE 802.1Qbv/Qbu/Qav, relevant to the in-vehicle backbone carrying V2X data from the connectivity domain controller to the ADAS domain.
Microchip does not publicly market CryptoAutomotive as a V2X product. The link from the ATECC608 family to V2X is an inference about capability, not a vendor claim.
Where the differences that matter actually live.
| Part | Certification | Notable specification |
|---|---|---|
| Infineon SLS37 V2X HSM | Common Criteria EAL4+, compliant with C2C-CC Protection Profile “V2X Hardware Security Module” v1.4.1 — Infineon's published claim for its own silicon | 20 ECDSA signature generations per second; 2,000 key slots, 20 file slots, 17-year data retention; SPI at 10 MHz; 1.6–3.6 V; AEC-Q100 up to 105 °C ambient; 5×5 mm 32-pin VQFN |
| NXP SXF1800 | Common Criteria EAL4+, AVA_VAN.5, C2C-CC V2X HSM PP — NXP's published claim for its own silicon | ECC NIST and Brainpool, secure firmware update, −40 to +105 °C, AEC-Q100 |
| AmbiSEC | Built to Common Criteria EAL6+ secure-element requirements | 25 × 25 mm solder-down module; ECDSA P-256/P-384; JavaCard V2X applet; SCP03 personalisation. AmbiSEC |
Note the deliberate asymmetry in the Infineon figure: 20 signature generations per second sounds low until you notice it is signing only. A vehicle signs one message per 100 ms. Verification is the volume problem, and it is normally done on the host SoC. Verification throughput →
What you can actually buy as a box or a module.
- Cohda Wireless MK6 / MK6 RSU — dual-stack: two NXP SAF5400 for DSRC plus a Qualcomm SA515 for C-V2X PC5 Release 14 and 5G NR Release 15. DSRC transmit power +22 dBm (ETSI Mask C), C-V2X +21.5 dBm (Class 3). Receive sensitivity −99 dBm at 3 Mbit/s. GNSS with RTK. Security via SXF1800. Standards: IEEE 802.11-2012, 1609.3-2020, 1609.2-2022. Certifications: OmniAir, FCC, ISED, CE, UKCA, KC. The first FCC-certified C-V2X RSU in the US.
- Commsignia — OBU, OBU Lite and RSU hardware plus a full V2X software stack, OmniAir-certified RSU, Build America Buy America compliant units for US federally funded projects, stack available on Qualcomm Snapdragon automotive platforms.
- Unex Technology — V2X system-on-module products and evaluation boards. First in the world to achieve OmniAir C-V2X module certification.
- Quectel — AG18 C-V2X module; AG55xQ series 5G NR plus C-V2X automotive modules; AG59x series automotive-grade 5G NR Release 16.
- Hyundai Mobis MTCU Gen1 / Gen2 — production V2X modules launched 29 August 2023 on Autotalks silicon; C-V2X, dual channel, Day-1 and Day-2 capable, ASIL-grade for actuation on V2X data.
- u-blox THEO-P1 — embedded V2X transceiver module built on Cohda IP.
- Yunex Traffic RSU2X, Kapsch TrafficCom, Applied Information, Danlaw AutoLink, Denso — infrastructure and OBU platforms. Denso supplied the common prototype OBU platform used by Toyota, Honda and Hyundai in the Tampa THEA pilot.
- China: Huawei, Datang/CICT, Neusoft Reach, Genvict and Nebula Link dominate the domestic module, OBU and RSU market.
Where this fits.
C-V2X
The modes and releases these parts implement.
Hardware root of trust
The verification-throughput question every one of these parts should be asked.
AmbiSEC
The Ambimat secure-element module, and where it sits in this table.
Stacks and SDKs
The evaluation kits built around this silicon.
Suppliers and ecosystem
The same landscape by layer, including PKI operators and test houses.
Test and certification
The OmniAir programmes several of these parts hold.
Questions this page answers.
Which companies make V2X chipsets?
Qualcomm (including the acquired Autotalks portfolio), NXP, and a set of module makers building on those — Unex, Quectel, Commsignia, Cohda, Hyundai Mobis. In China, Huawei, Datang/CICT and Genvict. Dedicated V2X hardware security modules come from Infineon and NXP.
Does a V2X chipset include security hardware?
Some do. Autotalks CRATON2 and TEKTON3 integrate an eHSM with line-rate ECDSA verification. NXP's approach is a separate secure element, the SXF1800, alongside the SAF5400 modem. Others expect the integrator to add a discrete secure element. Whether the security is integrated or discrete is a real architectural choice with consequences for certification scope, supply chain and upgradeability.
How many signatures per second does a V2X device need to verify?
NHTSA's requirement for DSRC equipment was that it validate at least 5,500 Basic Safety Messages per second in congested conditions. Published measurements of real on-board units found roughly 35 verifications per second in software and 163 with a hardware crypto module — a shortfall of more than thirty times. This gap is the entire reason verify-on-demand strategies exist. Hardware root of trust.